发明名称 Metal film production apparatus and method
摘要 <p>A metal film production apparatus, comprising: a chamber accommodating a substrate having a barrier metal film of a metal nitride formed thereon; diluent gas supply means for supplying a diluent gas to an interior of the chamber above a surface of the substrate; surface treatment plasma generation means which converts an atmosphere within the chamber into a plasma to generate a diluent gas plasma so that the barrier metal film on the surface of the substrate is etched with the diluent gas plasma to flatten the barrier metal film; a metallic etched member provided in the chamber; source gas supply means for supplying a source gas containing a halogen to an interior of the chamber between the substrate and the etched member; plasma generation means which converts the source gas containing the halogen into a plasma to generate a source gas plasma so that the etched member is etched with the source gas plasma to form a precursor from a metal component contained in the etched member and the source gas; and control means which makes a temperature of the substrate lower than a temperature of the etched member to form the metal component of the precursor as a film on the flattened barrier metal film. </p>
申请公布号 EP1475453(A3) 申请公布日期 2006.01.11
申请号 EP20040017492 申请日期 2002.10.28
申请人 MITSUBISHI HEAVY INDUSTRIES, LTD. 发明人 SAKAMOTO, HITOSHI;YAHATA, NAOKI;MATSUDA, RYUICHI;OOBA, YOSHIYUKI;NISHIMORI, TOSHIHIKO
分类号 H01L21/28;C23C8/36;C23C16/34;C23C16/448;C23C16/452;C23C16/507;C23C16/56;C23C28/00;C23C30/00;H01L21/768;(IPC1-7):C23C14/00;C23C14/02;C23C14/06;C23C14/16;C23C28/02 主分类号 H01L21/28
代理机构 代理人
主权项
地址