| 摘要 |
PROBLEM TO BE SOLVED: To obtain an inexpensive wiring board with high connection reliability having a connection pad for directly surface-mounting a semiconductor element on a wiring board, or the wiring board on an outside electric circuit board without forming a spherical terminal constituted of solder at the connection pad. SOLUTION: This is a wiring board 1 in which a wiring conductor 3 is integrally formed with an insulating substrate 2 constituted of a ceramic sintered body, and a conductor 4 constituted of conductive materials and glass packed in a via hole formed corresponding to a connection pad for input and output on the insulating substrate 2 is projected from the surface of the wiring substrate 1 in height which is 20-20μm for forming connection pad. It is preferred that Cu is conductive materials, 30-40 weight % of glass whose softening point 100-180μm. |
