发明名称 |
Novel flexible copper-coated laminate and flexible printed circuit board |
摘要 |
<p>The object of the invention is to embody further thinning of a double layer flexible printed circuit board (FPC) and provide a flexible copper-coated laminate capable of producing such a novel flexible printed circuit board distinguished in bending characteristic and heat-resistant property and provide a printed circuit board using the novel flexible copper-coated laminate. To achieve the above object, novel flexible copper-coated laminates 10 and 12 according to the present invention are respectively composed by directly forming a copper layer 16 having a thickness of 10 mu m or less than 10 mu m on a single surface or both surfaces of polyimide film 14 which is composed of polyimide polymer containing modulus of initial tensile elasticity of 400kg/mm<2> or more than 400kg/mm<2>, and which has a thickness of 10 mu m or less than 10 mu m. <IMAGE></p> |
申请公布号 |
EP0786928(B1) |
申请公布日期 |
2006.01.11 |
申请号 |
EP19960100913 |
申请日期 |
1996.01.23 |
申请人 |
KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA |
发明人 |
KATAOKA, KOSUKE;KURIBAYASHI, EIICHIRO;OHNARI, YOSHIHIDE |
分类号 |
B32B15/08;H05K3/02;B32B15/088;B32B15/20;H05K1/03 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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