INTERFERENCE MITIGATION THROUGH CONDUCTIVE THERMOPLASTIC COMPOSITE MATERIALS

摘要

An electromagnetic radiation interference mitigation shield is provided for an electronic circuit component. The shield includes a body formed from an electrically and thermally conductive composite material characterized by a volume resistivity ranging from about 0.1 to about 1,000 ohm-cm and a thermal conductivity ranging from about 10x10<-4>-cal.-cm./sec.-cm.<2>-° C. to about 30x10<-4>-cal.-cm./sec.-cm.<2>-° C.