发明名称 Non-contact IC card and process for its production
摘要 In a non-contact IC card comprising a substrate and provided thereon at least an IC chip and an antenna coil formed by etching, a connecting terminal of the antenna coil and a connecting bump of the IC chip are interconnected in a face-down fashion via an anisotropic conductive adhesive layer, or interconnected by wire bonding. <IMAGE>
申请公布号 EP0737935(B1) 申请公布日期 2006.01.11
申请号 EP19960105737 申请日期 1996.04.11
申请人 SONY CHEMICALS CORPORATION 发明人 ORIHARA, KATSUHISA;FUJIMOTO, MASAHIRO;MONKAWA, HARUO;KURITA, HIDEYUKI
分类号 B42D15/10;G06K19/077;G06K19/07 主分类号 B42D15/10
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