| 摘要 |
Disclosed is an inverter power module for use in the electric and electronic product, which includes: first elements constituting a power block; second elements constituting an inverter block; a mainboard on which the first elements are arranged; and a sub-board on which the second elements are arranged and mounted on the mainboard. On one portion in the front side of the main board, a sub-board mounting part for mounting the sub-board is provided. The sub-board mounting part has at least one connector and the sub-board has a pin header that corresponds to the connector. With these components, the sub-board is DIP-mounted on the mainboard. According to such construction, a plurality of the second elements having high probability of defect are included in the sub-board and mounted on the mainboard, whereby improvement in productivity and increase in yield are expected and defect generation can be minimized. |
