发明名称 Laser beam machining device
摘要 A laser material processing apparatus for processing a workpiece ( 22 ) in such a way as to separate one laser light ( 26 ) into two laser beams ( 26 a , 26 b) via first polarizer ( 25 ), one laser beam being passed via the mirrors ( 24 ), the other laser beam being scanned biaxially by a first galvano scanner ( 29 ), and conduct two laser beams ( 26 a , 26 b) to a second polarizer ( 27 ) for scanning via a second galvano scanner ( 30 ), wherein an optical path is constituted such that the laser beam ( 26 b) transmitted through the first polarizer ( 25 ) is reflected by the second polarizer ( 27 ), and the laser beam ( 26 a) reflected by the first polarizer ( 25 ) is transmitted through the second polarizer ( 27 ).
申请公布号 US6984802(B2) 申请公布日期 2006.01.10
申请号 US20040495781 申请日期 2004.05.17
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 KUROIWA TADASHI;IJIMA KENICHI;KOBAYASHI NOBUTAKA
分类号 B23K26/06;B23K26/067;B23K26/38 主分类号 B23K26/06
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