Surface position detection apparatus and method, and exposure apparatus and device manufacturing method using the exposure apparatus

摘要

An exposure apparatus has a surface position detection apparatus for measuring the surface position of a measurement area on the surface of a wafer. The surface position detection apparatus scans a shot area on the wafer having a pattern structure and detects the surface position of a measuring point provided within the shot. Prior to detecting the surface position of the measuring points within the shot, drive parameters for the surface position detection apparatus are determined according to a scanning speed employed for the shot in order that a measurement area of the surface position detection apparatus for the measuring points assumes a preset size. The surface position detection apparatus is then driven according to the parameters so determined, measuring the surface position of the measuring point in the shot. The exposure process is then controlled in accordance with the results of those measurements.