发明名称 |
High density electronic cooling triangular shaped microchannel device |
摘要 |
An isosceles triangular cross section shaped microchannel-cooling device conducts a working fluid for the removal of heat from a heat source. The triangular shaped microchannel provides an increased thermal transport coefficient for improved heat transport with an improved mass flow rate. The microchannel-cooling device is well suited for removing heat from electronics, semiconductor components, and systems.
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申请公布号 |
US6983792(B2) |
申请公布日期 |
2006.01.10 |
申请号 |
US20020305624 |
申请日期 |
2002.11.27 |
申请人 |
THE AEROSPACE CORPORATION |
发明人 |
DICKEY JAMES TODD;LAM TUNG TING |
分类号 |
H05K7/20;H01L23/473 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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