发明名称 High density electronic cooling triangular shaped microchannel device
摘要 An isosceles triangular cross section shaped microchannel-cooling device conducts a working fluid for the removal of heat from a heat source. The triangular shaped microchannel provides an increased thermal transport coefficient for improved heat transport with an improved mass flow rate. The microchannel-cooling device is well suited for removing heat from electronics, semiconductor components, and systems.
申请公布号 US6983792(B2) 申请公布日期 2006.01.10
申请号 US20020305624 申请日期 2002.11.27
申请人 THE AEROSPACE CORPORATION 发明人 DICKEY JAMES TODD;LAM TUNG TING
分类号 H05K7/20;H01L23/473 主分类号 H05K7/20
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