| 发明名称 |
Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy |
| 摘要 |
A lead-free solder powder that can include a plurality of lead-free solder particles each having a general spherical shape with a diameter of 20-60 mum. Each of the lead-free solder particles can contain Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.
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| 申请公布号 |
US6984254(B2) |
申请公布日期 |
2006.01.10 |
| 申请号 |
US20030337373 |
申请日期 |
2003.01.07 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
TAKESUE MASAKAZU;MORIYA YASUO;NEMOTO YOSHINORI;FUKUSHIMA YUMIKO |
| 分类号 |
B23K3/06;B23K35/26;B23K31/02;B23K35/02;B23K35/22;B23K35/36;B23K35/363;H05K3/24;H05K3/34 |
主分类号 |
B23K3/06 |
| 代理机构 |
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