发明名称 MAGNETRON SPUTTERING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a magnetron sputtering device having a target whose using efficiency is high by a simple constitution. SOLUTION: In the magnetron sputtering device 1 comprising: a vacuum chamber 2; a cathode 4 located in the vacuum chamber 2 and holding the target 3; an anode 6 located in the upper part of a cathode 4 and holding a substrate 5 so as to face the side of the target 3 in the cathode 4; and a permanent magnet located in the lower part of the cathode 4 and generating a magnetic field 12, the permanent magnet 7 is composed of a base 8 fixing the magnet; a first permanent magnet 9 fixed to the central part of the base 8; and a square second permanent magnet 10 fixed to the edge part of the base 8 and surrounding the first permanent magnet 9, and in which the polarity of the magnetic pole is opposite to that of the first permanent magnet 7, and also, the magnetic field intensity is weaker than that of the first permanent magnet 7. Further, a movement control part 11 for vertically moving or horizontally moving the permanent magnet 7 to the cathode 4. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006002244(A) 申请公布日期 2006.01.05
申请号 JP20040182724 申请日期 2004.06.21
申请人 VICTOR CO OF JAPAN LTD 发明人 IZEKI TAKAYUKI
分类号 C23C14/35 主分类号 C23C14/35
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