| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin-type solid electrolytic capacitor that can be incorporated into a wiring board and can be arranged near a semiconductor chip, such as a CPU, mounted onto the wiring board, and to provide a method for manufacturing the solid electrolytic capacitor. SOLUTION: In the solid electrolytic capacitor 40: there are first and second electrodes 38, 25 of the capacitor on one surface and the other, respectively, of an insulating body 10 formed by two insulating members 11, 21 connected by anode junction; a dielectric layer 15a' is positioned inside the body; and a solid electrolyte 31a and a conductive member 15 are positioned in the region of the body between the dielectric layer 15a' and the first electrode 38 and in the region of the body between the dielectric layer 15a' and the second electrode 25, respectively. COPYRIGHT: (C)2006,JPO&NCIPI
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