Semiconductor device packages including hermetic packaging elements for at least partially encapsulating conductive elements and other package elements for protecting the portions of semiconductor devices not covered by the hermetic package elements, and packaging methods

摘要

A semiconductor device package includes a semiconductor device and at least one conductive element in communication with a contact of the semiconductor device. A hermetic package element encapsulates at least a portion of the conductive element and the contact from which the conductive element protrudes or extends. Another element of the package encapsulates the remainder of the semiconductor device. The conductive element may comprise an intermediate conductive element, such as a bond wire, a discrete conductive element, such as a solder structure, or leads. One or both of the hermetic package element and the other element of the package may include a plurality of adjacent, mutually adhered regions, as are formed by programmed material consolidation processes. Packaging methods are also disclosed.