SEMICONDUCTOR PACKAGE HAVING INTEGRATED METAL PARTS FOR THERMAL ENHANCEMENT

摘要

A semiconductor device comprises a chip (101) mounted on a leadframe (103) beneath a central portion (110a) of a heat spreader (110). The heat spreader (110) has positioning members (110b) extending outwardly and downwardly from the central portion (110a) into grooves (106) of the leadframe (103). Encapsulation material (120) fills the void between the chip (101) and the heat spreader (110). Straps (105) received in grooves (106) hold tips (111) of the members 1 l0b against the pressure of the inserted encapsulation material (120).