发明名称 Apparatus and method for drying under reduced pressure, and coating film forming apparatus
摘要 In drying a coating liquid such as a resist applied to a substrate under reduced pressure, a coating film in a peripheral portion tends to lose good shape regardless of duration of a drying period, and it is difficult to set an appropriate exhaust flow rate. After the substrate is loaded in an airtight container, a pressure is reduced from atmospheric pressure to a pressure slightly higher than the vapor pressure of a solvent, for example. Then, the solvent actively evaporates from the coating liquid. Here, evacuation is performed initially based on a first flow rate set value Q 1 , and thereafter, it is performed based on a second flow rate set value larger than Q 1 . Rounding of the surface in the peripheral portion is corrected by evacuation based on Q 1 , and more active evaporation of a solvent component is attained by switching to Q 2.
申请公布号 US2006003105(A1) 申请公布日期 2006.01.05
申请号 US20050212725 申请日期 2005.08.29
申请人 TOKYO ELECTRON LIMITED 发明人 KOBAYASHI SHINJI;KITANO TAKAHIRO;SUGIMOTO SHINICHI
分类号 B05D1/40;B05D3/02;B05C9/12;B05C11/08;B05D3/04;B05D3/12;H01L21/00;H01L21/027 主分类号 B05D1/40
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