| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting device attached onto a submount. <P>SOLUTION: A device comprises a semiconductor light-emitting device, having contact on the same side of the device. The device is attached to a transparent submount, having a conductive via electrically connected with the contact in a flip-chip structure. The method of manufacturing the semiconductor light-emitting device comprises the step of forming a light-emitting active region between a first conductivity-type first region and a second conductivity-type second region on a growth substrate. A contact region is passed through the second region, through the active region, and partially through the first region, and is etched. The contact is formed on the first region, that is, on the etched contact region and the second region. A transparent submount having the conductive via is prepared, and the transparent submount is combined with an assembly, before the growth substrate is removed. Then, the submount and the assembly are diced together, and the submount and the assembly, having almost the identical footprint, are obtained. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
