发明名称 CIRCUIT STRUCTURE BODY
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a circuit structure body which can securely detect the soldering defect of an electronic component connected to a bus bar and a control circuit board and is superior in connection reliability. <P>SOLUTION: An opening 14B is formed in the circuit board 11, and a connection protrusion 16 projected into the opening 14B is formed in the bus bar 13. The connection protrusion 16 is soldered with the source terminal 17B of the semiconductor switching element 12A. Thus, a soldering state is more easily recognized by eyes compared to a case when the bus bar 13 and the source terminal 17B are soldered at the base of the opening 14B. Consequently, connection reliability of the semiconductor switching element 12A can be improved. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006005096(A) 申请公布日期 2006.01.05
申请号 JP20040178664 申请日期 2004.06.16
申请人 AUTO NETWORK GIJUTSU KENKYUSHO:KK;SUMITOMO WIRING SYST LTD;SUMITOMO ELECTRIC IND LTD;TOYOTA MOTOR CORP 发明人 TOMIKAWA TADASHI;TOMITA TAKAYUKI;SHIBATA MASAO
分类号 H05K1/18;H02G3/16;H05K7/06 主分类号 H05K1/18
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