| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for wiring circuit formation capable of improving the adhesiveness between an insulating layer and a conductive pattern and preventing delamination in metal thin layer, and to provide a wiring circuit substrate for which the substrate is employed and a method of forming a metal thin layer for forming the metal thin layer. SOLUTION: A first metal 35 and a second metal 36 are sputtered so that a first metal scattering region 37 where the first metal 35 scatters and a second metal scattering region 38 where the second metal 36 scatters may be overlapped, thereby forming a metal thin layer 2 on a base insulating layer 1. The metal thin layer 2 is thus formed so that a first metal maldistribution portion 4 having the first metal 35 unevenly distributed and adjacent to the base insulating layer 1, a second metal maldistribution portion 5 having the first metal 36 unevenly distributed and adjacent to a conductive pattern 6, and a metal coexisting portion 3 provided between the portions 4 and 5 and having the first and second metals 35 and 36 which coexist may continuously exist without the border. COPYRIGHT: (C)2006,JPO&NCIPI |
