| 摘要 |
PROBLEM TO BE SOLVED: To provide a film-forming composition suitable for forming the film used for forming a semiconductor wiring and the film obtained by using the composition. SOLUTION: This film-forming composition is obtained by using at least (A) a carbosilane-based polymer having a recurring unit expressed by general formula (1) [wherein, R<SB>1</SB>, R<SB>2</SB>are each independently H or a 1-20C alkyl; and (m) is 0-20 integer] and (B) a solvent, and the film is obtained by curing a coated film formed by using the film-forming composition. COPYRIGHT: (C)2006,JPO&NCIPI |
