| 摘要 |
<P>PROBLEM TO BE SOLVED: To make an imaging module small-sized and to provide it as a product with high reliability. <P>SOLUTION: The imaging module is equipped with a lens barrel 23 supporting an optical lens 20, an imaging element 26 photodetecting an image through the optical lens, and a semiconductor element 27 for control, the imaging element 26 is mounted on a lead frame 16, and the one-surface side of the lead frame where the imaging element is mounted is molded out of resin so that light can be made incident on a photodetection surface of the imaging element 26 to provide a resin molding part 40 as a main body of the imaging module, and the lens barrel 23 supporting the optical lens is fitted to the resin molding part 40 while fixed in an arrangement for forming an image on the photodetection surface of the imaging element 26. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
