| 摘要 |
PROBLEM TO BE SOLVED: To provide an AuSn die bonder which will not give thermal shocks to a chip and makes the chip temperature rise more quickly. SOLUTION: A preheater is provided, and a chip sucked by a collet is pressed against the preheater and is heated. The preheater, which comprises a small aluminum block, is attached to an arm made of a heat insulating material and is normally made to float by a spring so that a gap is secured inbetween the surface of the heater and the surface of the aluminum block. COPYRIGHT: (C)2006,JPO&NCIPI
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