发明名称 Semiconductor device substrate with embedded capacitor
摘要 A method for forming a semiconductor device including a DRAM cell structure comprising a silicon on insulator (SOI) substrate with an embedded capacitor structure including providing a substrate comprising an overlying first electrically insulating layer; forming a first electrically conductive layer on the first electrically insulating layer to form a first electrode; forming a capacitor dielectric layer on the first electrode; forming a second electrically conductive layer on the capacitor dielectric layer to form a second electrode; forming a second electrically insulating layer on the second electrode; and, forming a monocrystalline silicon layer over the second electrode to form an SOI substrate comprising a first capacitor structure.
申请公布号 US2006003522(A1) 申请公布日期 2006.01.05
申请号 US20040881372 申请日期 2004.06.30
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 LIN CHUN-CHIEH;LEE WEN-CHIN
分类号 H01L21/8234;H01L21/8242;H01L21/8244 主分类号 H01L21/8234
代理机构 代理人
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