LOWERED PRESSURE POINT FOR HEAT SINK RETENTION HARDWARE

摘要

A heat sink assembly (10) includes a heat sink with a base plate having a top surface with fins for dissipating heat and an opposed bottom surface for placing against an electronic device (4) mounted on a printed circuit board, and at least one connecting device (2) for loading the heat sink against the electronic device. The connector includes a mechanical fastener such as a push pin having an end which engages the circuit board, a compression spring (43) received against a shoulder on the fastener, and a cup member which is installed in an aperture in the base plate so that a floor of the cup member provides a bearing surface for the spring which is below the bottom surface of the base plate. An alternative connector utilizes a conical spring received through the base plate and receiving the fastener therein to load the spring in tension against the electronic device.