| 摘要 |
A semiconductor electronic device comprises a chip of a semiconductor material, a set of metal conductors (33,38) adjacent to the plate, a set of wire leads joining selected points on the chip to the metal conductors, and a supporting metal plate (32) formed of three portions having a total surface area which is substantially less than the surface area of the chip, and forming a H-shaped supporting structure. All this, except the ends of the metal conductors, is encapsulated within a plastics material body. <IMAGE> |
