| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate cutting method capable of cutting a substrate along the scribe line without failure, and a substrate cutting unit. SOLUTION: This method comprises a process in which both ends of a scribe line SLb and a tip 19 of a pressing part is shot from the side of a substrate 1, a process in which the coordinates data of the scribe line SLb and the tip 19 of the pushing part are extracted from the images obtained by the shooting, a process in which the slanting angleθof the one to the other of the scribe line SLb and the tip 19 of the pressing part, and the location shift valueΔXa between the scribe line SLb and the tip 19 of the pressing part are calculated, and a process in which the scribe line SLb and the tip 19 of the pressing part are met by relatively moving the substrate 1 to the pressing part 18 according to the inclination angleθand the location shift valueΔXa, and a process in which the tip 19 of the pressing part is abutted on the substrate 1 and press it. COPYRIGHT: (C)2006,JPO&NCIPI
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