发明名称 |
Circular wire-bond pad, package made therewith, and method of assembling same |
摘要 |
A wire-bonding substrate includes a curvilinear wire-bond pad. The curvilinear wire-bond pad is used in reverse wire bonding to couple a die with the substrate. A curvilinear wire-bond pad is also disclosed that is located directly above the via in the substrate. A wire-bonding substrate includes a first wire-bond pad and a first via that is disposed directly below the first wire-bond pad in the wire-bonding substrate. A package is includes a chip stack with a total die-side characteristic dimension, and a total substrate-side characteristic dimension that is smaller than the total die-side characteristic dimension. A computing system includes the curvilinear wire-bond pad.
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申请公布号 |
US2006000876(A1) |
申请公布日期 |
2006.01.05 |
申请号 |
US20040881741 |
申请日期 |
2004.06.30 |
申请人 |
NICKERSON ROBERT;TAGGART BRIAN;DING HAI |
发明人 |
NICKERSON ROBERT;TAGGART BRIAN;DING HAI |
分类号 |
B23K31/02 |
主分类号 |
B23K31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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