| 摘要 |
A method for mounting semiconductor chips onto a substrate with which substrate places are arranged in columns, whereby the semiconductor chips adhering to a foil are presented on a wafer table, whereby the detachment of a semiconductor chip from the foil is supported by means of a die ejector and whereby a Pick and Place device picks the semiconductor chip presented above the die ejector and deposits it onto the substrate comprises: Forward feeding the substrate along a transport direction designated as x direction, Equipping a predetermined number of columns with semiconductor chips in accordance with the steps: Moving the Pick and Place device to an x position corresponding to the column to be equipped, Moving the die ejector to this x position, and Equipping the substrate places of the column.
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