| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin film remover which reduces the height, width and undulation of a mound to be generated in the border between a part having a residual thin film on a substrate and a part where the thin film is removed, in a process for removing the unnecessary thin film deposited on the periphery of the substrate after forming the thin film on the square substrate. SOLUTION: The thin film remover is an apparatus which removes the unnecessary thin film on the periphery of the substrate after forming the thin film on the square substrate. The apparatus is provided with at least a nozzle head for a straight portion which is disposed so as to cover a straight portion where one main face of the square substrate crosses one side face thereof, and a mechanism for relatively translating the nozzle head for straight portion along the side face of the square substrate. The nozzle head for straight portion is provided with a release liquid supply port, a waste liquid suction port, and gas outlet ports. The nozzle head is provided with a release liquid main conduit from the release liquid supply port to the waste liquid suction port along the inside of the nozzle head from the straight line, conduit for discharge, and discharge shielding walls which run therewith. COPYRIGHT: (C)2006,JPO&NCIPI |
