| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus for rapidly and reliably drying a substrate by drying process that is performed after wet washing process, and to quickly remove an unneeded thin film formed at and adhered to the bevel and edge sections of the substrate while obtaining a steel slope edge profile even if the film is hard, and to restrain surface roughness at the bevel and edge sections after removing the unneeded thin film. SOLUTION: The substrate processing apparatus comprises a substrate holder 22 for retaining the substrate W; and dry gas supply sections 32, 36 for setting an atmosphere in which at least one portion of the surface of the substrate W retained by a substrate holder 22 is exposed to a dry gas atmosphere whose moisture is controlled. The substrate processing system comprises a polishing apparatus for polishing the thin film formed at and adhered to the bevel and edge sections of the substrate; and an etching device for removing the thin film remaining at the bevel and edge sections of the substrate after polishing by the polishing apparatus by etching. COPYRIGHT: (C)2006,JPO&NCIPI
|
