发明名称 RGB light emitting diode package with improved color mixing properties
摘要 Disclosed is an RGB light emitting diode package with improved color mixing properties. The RGB light emitting diode package includes red, green, and blue light emitting diode chips provided on a reflector, on which elements are to be installed or mounted. A photomixing material and a filler resin scatters rays so as to uniformly mix the rays emitted from the light emitting diode chips. The photomixing material and filler resin are applied onto upper sides of the light emitting diode chips while being mixed with each other, and the photomixing material is uniformly dispersed in the filler resin. The RGB light emitting diode package according to the present invention is advantageous in that since it has excellent color mixing properties in a relatively small area, it is possible to achieve slimness of the package, while it is difficult to design a slim package using a conventional process in which there is a limit that an area large enough to mix colors must be provided.
申请公布号 US2006001034(A1) 申请公布日期 2006.01.05
申请号 US20040959154 申请日期 2004.10.07
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 PARK YOUNG S.;HAHM HUN J.;KIM HYUNG S.;PARK JUNG K.;JEONG YOUNG J.
分类号 H01L25/075;H01L33/32;H01L33/56 主分类号 H01L25/075
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