| 摘要 |
The invention relates to an epoxy resin composition containing (a) an epoxy resin and (b) a phenolic hydroxy group-containing polyamide resin having the structure represented by Formula (1), a method of curing the composition, a varnish, prepreg, or sheet using the composition, and an epoxy resin composition having the polyamide resin represented by Formula (1) as the active component. Cured products of the epoxy resin composition according to the present invention have a sufficient high flexibility when formed into a thin film, have a flame resistance even though the cured compositions do not contain a halogen flame retardant, an antimony compound, or the like and are superior in heat resistance and adhesiveness, and thus are extremely useful in a wide range of applications, for example, as molded materials, cast materials, laminate materials, paints, adhesives, resists, and the like. (wherein, 1 and m are averages, satisfying the formula: m/(1+m) =0.01; and 1+m is a positive number of 2 to 200. Ar<SUB>1 </SUB>represents a bivalent aromatic group; Ar<SUB>2 </SUB>represents a phenolic hydroxyl group-containing bivalent aromatic group; and Ar<SUB>3 </SUB>represents: -ph(R<SUB>1</SUB>)n- or -ph(R<SUB>2</SUB>)n-X-ph(R<SUB>3</SUB>)n-, wherein, -ph(R<SUB>1</SUB>)n-, -ph(R<SUB>2</SUB>)n- and -ph(R<SUB>3</SUB>)n- represent respectively R<SUB>1</SUB>-substituted, R<SUB>2</SUB>-substituted and R<SUB>3</SUB>-substituted phenylene groups, or an unsubstituted phenylene group; n is an integer of 0 to 3; R<SUB>1</SUB>, R<SUB>2 </SUB>and R<SUB>3 </SUB>each independently represent a C1 to C3 alkyl group or a C1 to C3 alkoxy group; and X represents O, S, CO, SO<SUB>2 </SUB>or a single bond)
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