| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for radiation image pick-up and a radiation image pick-up device, which are not generating capacity deterioration and rupture due to static electricity even when the substrate is charged in its manufacturing process. SOLUTION: The substrate for radiation image pick-up comprises a plurality of semiconductor converting elements arranged on an insulating substrate in the shape of matrix to convert radiation into electric charge; switch elements connected to the semiconductor converting elements, bias lines (Vs lines) for impressing bias on the semiconductor elements, gate lines (Vg lines) for supplying driving signals to the switch elements and a pixel area consisting of signal lines (Sig lines) for reading out the charge converted by the semiconductor converting elements. In such a substrate for radiation image pick-up, interconnection lines having photoelectric conversion layer are formed out of the pixel area, and the interconnection lines connect at least a plurality of same kind of interconnection lines among the vias lines, gate lines and signal lines. COPYRIGHT: (C)2006,JPO&NCIPI
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