Chemical application apparatus and chemical application method

摘要

A chemical application apparatus includes: holding section for holding a substrate, and an application nozzle which is capable of moving over the substrate held by the holding section and which supplies a chemical onto the surface of the substrate. Further, it includes: storage section for storing pattern information for forming a pattern on the substrate; position computing section for computing a relative position of the application nozzle with respect to a measurement mark provided on the substrate; and control section for forming the pattern by applying the chemical onto the substrate through the application nozzle based on the relative position and the pattern information.