| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a module structure and a mounting structure with low heat resistance, low cost and high reliability in a power semiconductor module of a structure where cooling water is directly applied to a metal base so as to cool it. <P>SOLUTION: A metal frame with large rigidity is arranged at the periphery of an insulating substrate bonding face so that the metal frame is closely brought into contact with the metal base. In the structure, the metal frame, the metal base and a cabinet are fastened together and cooling water can securely be sealed. Since the metal base is annealed to be thinner than an insulating substrate with circuit pattern, rigidity is small and it is soft. Since the metal base is deformed in the structure, distortion of the insulating substrate bonding layer is relieved and reliability becomes high. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
