| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition which enables to simply and certainly perform the electric connection of layer-to-layer of a circuit board by melting a solder bump, and to provide a carrier material provided with a resin and a multilayer printed wiring board. SOLUTION: The resin composition is one used for forming the resin layer of a sheet-like, resin-equipped carrier material and comprises an epoxy resin, a curing agent and a compound having fluxing activity. The resin composition is characterized by having a gel time of 40-60 minutes at 120°C. COPYRIGHT: (C)2006,JPO&NCIPI |
