| 摘要 |
PROBLEM TO BE SOLVED: To provide heat treatment equipment which has superior cooling performance and is simple in structure by injecting liquid droplet aerosol into a cooling chamber and by cooling a heating plate, making use of evaporation of the liquid droplet aerosol. SOLUTION: The heat treatment equipment includes the heating plate having a heater, a chamber housing which is combined with the lower part of the heating plate, where the cooling chamber is formed within it, at least one spraying means which is provided at the chamber housing and which generates the liquid droplet aerosol mixing liquid for cooling with air, and at the same time, injects the liquid droplet aerosol into the cooling chamber. With such a constitution, since the heating plate is cooled by a phase change heat transfer system, the cooling performance is superior; the heating plate is cooled down quickly to the desired temperature, without losing the liquid droplet aerosol supplied; an evacuation system is simply constituted, without the risk of water leakage than in heat treatment equipment of conventional liquid cooling systems; and the productivity of a semiconductor is improved, for a wafer baking process and a cooling process progress by turns in a single baking unit. COPYRIGHT: (C)2006,JPO&NCIPI
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