发明名称 |
Light emitting devices having current blocking structures and methods of fabricating light emitting devices having current blocking structures |
摘要 |
Light emitting devices and methods of fabricating light emitting devices having a current blocking mechanism below the wire bond pad are provided. The current blocking mechanism may be a reduced conduction region in an active region of the device. The current blocking mechanism could be a damage region of a layer on which a contact is formed. The current blocking mechanism could be a Schottky contact between an ohmic contact and the active region of the device. A semiconductor junction, such as a PN junction could also be provided between the ohmic contact and the active region.
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申请公布号 |
US2006002442(A1) |
申请公布日期 |
2006.01.05 |
申请号 |
US20040881814 |
申请日期 |
2004.06.30 |
申请人 |
HABERERN KEVIN;BERGMANN MICHAEL J;MIECZKOWSKI VAN;EMERSON DAVID T |
发明人 |
HABERERN KEVIN;BERGMANN MICHAEL J.;MIECZKOWSKI VAN;EMERSON DAVID T. |
分类号 |
H01S5/00;H01L33/14 |
主分类号 |
H01S5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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