| 发明名称 |
Semiconductor devices with permanent polymer stencil and method for manufacturing the same |
| 摘要 |
Methods of manufacturing semiconductor devices using permanent or temporary polymer layers having apertures to expose contact pads and cover the active surfaces of the semiconductor devices.
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| 申请公布号 |
US2006003569(A1) |
申请公布日期 |
2006.01.05 |
| 申请号 |
US20050210606 |
申请日期 |
2005.08.23 |
| 申请人 |
FARNWORTH WARREN M;WOOD ALAN G;WARK JAMES M;HEMBREE DAVID R;AHMAD SYED S;HESS MICHAEL E;JACOBSON JOHN O |
发明人 |
FARNWORTH WARREN M.;WOOD ALAN G.;WARK JAMES M.;HEMBREE DAVID R.;AHMAD SYED S.;HESS MICHAEL E.;JACOBSON JOHN O. |
| 分类号 |
H01L21/44;H01L21/56;H01L21/60;H01L23/29;H01L23/31;H01L23/544 |
主分类号 |
H01L21/44 |
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