| 摘要 |
PROBLEM TO BE SOLVED: To provide a system for accommodating a semiconductor wafer in a hoop for conveyance, wherein the number of whoops is decreased enabling smooth conveyance. SOLUTION: A conveyance carriage 12 mounting a hoop 20a is travelled on an orbit 11 laid in a loop shape. Device groups 100, 200, 300 are disposed in the loop, and a conveyance in the device groups is carried out by a hoop 20b mounted on a conveyance carriage 14, which moves a conveyance route 13 laid on a floor. At a site where the conveyance route 13 meets the orbit 11, a station 100S, etc. are provided, and the semiconductor wafer, which has been accommodated and conveyed in the hoop 20b by the conveyance in the device group, is transferred into the hoop 20a mounted on the conveyance carriage 12 which travels on the orbit 11 by a wafer sorter 30a. The conveyance is carried out between the device groups in a mixedly mounted state, and the number of used hoops is suppressed, thereby enhancing the conveyance efficiency. COPYRIGHT: (C)2006,JPO&NCIPI
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