| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin-type solid electrolytic capacitor that can be incorporated into a wiring board, can be arranged close to a semiconductor chip, such as a CPU, mounted on the wiring board, and can form an electrolyte layer simply by an electrolytic polymerization method, and to provide a method for manufacturing the solid electrolytic capacitor. SOLUTION: The solid electrolytic capacitor 30 includes a linear conductive member 14 that forms a dielectric layer 14' between two parallel electrodes 11, 19 and on the surface and is connected to one of the two electrodes, and a solid electrolyte layer 16 that buries the linear conductive member 14 and is connected to the other of the two electrodes. The solid electrolytic capacitor can be manufactured by a method for using a base 11 as the first electrode for forming the dielectric layer 14' and using a conductive layer 12 formed by holding an insulating layer 13 on the base 11 as a second electrode for forming the solid electrolyte layer by electrolytic polymerization. COPYRIGHT: (C)2006,JPO&NCIPI
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