| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition molding material for encapsulation excellent in flame resistance, heat resistance and thermal cycle resistance and an electronic component device equipped with an element encapsulated with the epoxy resin composition molding material. SOLUTION: The epoxy resin composition molding material for encapsulation contains (A) an epoxy resin, (B) a hardener expressed by general formula (I) (wherein, n is 0 or a positive integer; and a hydrogen on the benzene ring may be substituted with a hydrocarbon group) and (C) an inorganic filler. Component (C) accounts for≥70 wt.% and≤88 wt.% of the total weight of the molding material. At least one component of the component (C) has a specific surface area of≤2.0 m<SP>2</SP>/g. COPYRIGHT: (C)2006,JPO&NCIPI
|
