| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a mounting inspecting method thereof whereby a connective state present between its semiconductor package and its mother board can be inspected more properly than a conventional method. SOLUTION: A semiconductor device 300 comprises a semiconductor package 100 and a mother board 200. The semiconductor package 100 has in its mounting surface 21 adjacently to its solder balls 122 a plurality of dummy terminals 124 which are fused in heating values different from ones of its solder balls 122 and are connected electrically in series with each other. The mother board 200 has on its mounting surface 201 a plurality of dummy pads 203 corresponding to the dummy terminals 124, and has outside its mounting region 204 for the semiconductor package 100 two testing pads 205 which are connected in a conductive way with its two dummy pads 203 corresponding to both ends of the dummy terminals 124 connected in series with each other. By using the semiconductor device 300, a resistance value generated between the testing pads 205 is so measured and is so compared with a predetermined reference value as to inspect the connective state present between the semiconductor package 100 and the mother board 200. COPYRIGHT: (C)2006,JPO&NCIPI
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