发明名称 Method of forming capacitor of semiconductor device
摘要 Disclosed is a method of forming a capacitor of a semiconductor device which can secure a desired leakage current characteristic while securing a desired charging capacitance. The inventive method of forming a capacitor of a semiconductor device comprises steps of: forming a bottom electrode on a semiconductor substrate with a storage node contact so that the bottom electrode is connected with the storage node contact; plasma-nitrifying the bottom electrode to form a first nitrification film on the surface of the bottom electrode; forming a La<SUB>2</SUB>O<SUB>3 </SUB>dielectric film on the bottom electrode including the first nitrification film; plasma-nitrifying the La<SUB>2</SUB>O<SUB>3 </SUB>dielectric film to form a second nitrification film on the surface of the La<SUB>2</SUB>O<SUB>3 </SUB>dielectric film; and forming a top electrode on the La<SUB>2</SUB>O<SUB>3 </SUB>dielectric film including the second nitrification film.
申请公布号 US2006003538(A1) 申请公布日期 2006.01.05
申请号 US20040999568 申请日期 2004.11.30
申请人 LEE KEE J 发明人 LEE KEE J.
分类号 H01L21/20 主分类号 H01L21/20
代理机构 代理人
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