摘要 |
Disclosed is a method of forming a capacitor of a semiconductor device which can secure a desired leakage current characteristic while securing a desired charging capacitance. The inventive method of forming a capacitor of a semiconductor device comprises steps of: forming a bottom electrode on a semiconductor substrate with a storage node contact so that the bottom electrode is connected with the storage node contact; plasma-nitrifying the bottom electrode to form a first nitrification film on the surface of the bottom electrode; forming a La<SUB>2</SUB>O<SUB>3 </SUB>dielectric film on the bottom electrode including the first nitrification film; plasma-nitrifying the La<SUB>2</SUB>O<SUB>3 </SUB>dielectric film to form a second nitrification film on the surface of the La<SUB>2</SUB>O<SUB>3 </SUB>dielectric film; and forming a top electrode on the La<SUB>2</SUB>O<SUB>3 </SUB>dielectric film including the second nitrification film.
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