| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an imprinting method and an imprinting apparatus which has positional accuracy compatible with nano imprint lithography for forming a fine pattern of about a few to few dozens of nanometers of a semiconductor device, to provide a mold member used for the imprinting apparatus, and to provide a method of patterning for forming a semiconductor element using the imprinting method. <P>SOLUTION: As part of pressurization, at least one convex structure is formed in the mold member while at the same time at least one concave is formed in a substrate in such a manner that the individual convex structures formed in the mold member and the individual concave structures formed in the substrate may pair with each other, and may be engaged with each other and held at prescribed positions. With the individual pairs of convex structure and concave structure as alignment portions, the mold member and the substrate are aligned with each other at the alignment portions. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
