| 摘要 |
PROBLEM TO BE SOLVED: To enable mounting without causing troubles wherein shortage between electrodes and lifting of a package during packaging, regarding a semiconductor device product in which a circuit component is mounted on a substrate and sealing is performed with resin. SOLUTION: The circuit component 20 is bonded to pads 11a, 11b arranged on the circuit board 25 with solder, and mounted on the circuit board and sealed with resin 22. Accordingly, the semiconductor device product 30 is formed. On a surface of the circuit board 25, an aperture hole 13 is formed which is used for bonding the circuit component 20 on the pads 11a, 11b with solder, and whose inner peripheral side surface 13a has an overhang profile, and covering is performed with a protective film 12. The circuit component 20 forms a clearance chunk which absorbs thermal expansion amount of solder when mounting the semiconductor device product 30 on the packaging substrate near the inner peripheral side surface 13b of the aperture hole 13, and the component 20 is mounted on the circuit board 25. COPYRIGHT: (C)2006,JPO&NCIPI
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