| 摘要 |
PROBLEM TO BE SOLVED: To complete cleaning of a gas discharge pipe in short time without damaging the gas discharge pipe, a valve and a vacuum pump, by preventing a local temperature rise and preventing unreacted cleaning gas from flowing into the vacuum pump in a non-plasma cleaning process of a deposited film forming device. SOLUTION: The size of a cleaning reaction area is changed by at least one means of increase/decrease of a flow rate of dilution gas while the flow rate of supplied cleaning gas is kept to be constant, the pressure rise of a chamber 101 or the gas discharge pipe 103 or fall of pressure. COPYRIGHT: (C)2006,JPO&NCIPI
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