| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board, a semiconductor device, and the manufacturing methods thereof whereby a high reliability is obtained when mounting a semiconductor element on the printed wiring board in a flip-chip way. SOLUTION: The printed wiring board has a metal plate 11 having an opening 11a for mounting therein a semiconductor element 30; a multilayer-wiring layer 23 wherein a plurality of wiring layers and a plurality of insulating layers are laminated alternately, and the plurality of wiring layers are connected with each other by vias; first conductive pads 15 which are so formed on the first surface of the multilayer wiring layer provided with the metal plate as to exist in the opening of the metal plate, and as to have the forms of pillars protruded from the first surface; and second conductive pads 21. Further, the height of the top of each first conductive pad which is measured from the boundary surface between the metal plate and the multilayer-wiring layer is substantially made equal to the thickness of the metal layer. COPYRIGHT: (C)2006,JPO&NCIPI |
