| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface treatment method for an electronic component having a contact and a soldered terminal where, at the time when an electronic component is soldering-packaged on a circuit board, the sucking-up of solder into the contact direction is prevented, and further, the improvement of the corrosion resisting performance of the electronic component and the reduction of cost are attained. SOLUTION: In the surface treatment method for an electronic component having a contact part at one end of a metal sheet and a terminal part solder-packaged on a circuit board at the other end, a stage (S1) where the metal sheet is subjected to substrate nickel plating; a stage (S2) where a noble metal plating layer is formed on the surface layer of the metal sheet subjected to the substrate plating treatment in such a manner that the contact part and the terminal part are thick-filmed, and the other part is thin-filmed; and a stage (S3) where heat treatment is uniformly performed, thus, utilizing a plating film thickness difference, an oxide film so as to be a solder barrier is selectively formed on the surface of the noble metal plating layer by substrate nickel diffusion are provided. COPYRIGHT: (C)2006,JPO&NCIPI
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