| 发明名称 |
CONTINUOUS CASTING OF COPPER TO FORM SPUTTER TARGETS |
| 摘要 |
<p>Continuous casting of copper to produce sputter targets (20). The resulting targets comprise a relatively low amount of inclusions therein and will result in reduced particulate sputtering leading to a more uniform coating that is sputtered onto the desired substrate.</p> |
| 申请公布号 |
WO2006002063(A1) |
申请公布日期 |
2006.01.05 |
| 申请号 |
WO2005US21030 |
申请日期 |
2005.06.15 |
| 申请人 |
HOLCOMB, MELVIN, K.;TOSOH SMD, INC. |
发明人 |
HOLCOMB, MELVIN, K. |
| 分类号 |
(IPC1-7):C23C14/34 |
主分类号 |
(IPC1-7):C23C14/34 |
| 代理机构 |
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代理人 |
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| 主权项 |
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