| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solid-state imaging device which has enhanced dustproof capabilities, yield, and productivity; and to provide a manufacturing method therefor. <P>SOLUTION: The solid-state imaging device comprises a photosensitive region 13 for performing photoelectric conversion which is formed in the center, a bonding pad region 15 formed around the photosensitive region 13, a solid-state image pickup element 12 having an adhesive member region formed on a surface between the photosensitive region 13 and bonding pad region 15 to surround the photosensitive region 13, a module chip 21 having a lens holder 20 fixed on the adhesive member 16 or a translucent board 17 for carrying the lens holder 20, a printed board 23 on which a component 24 is mounted that processes an output from the module chip 21 to obtain an image output, and a means for electrically connect between the bonding pad region 15 and printed board 23. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
